Logas offers the assembly of wide range of components in surface mount applications. Our system is equiped to handle the following: All BGA's (type and shape), Very fine pitch chips, QFN, Flip chips, Component sizes from 0402 up
Logas resently upgraded the through-hole process to leadfree. The process is equiped to handle all components in the through-hole application. Logas provides other modes of through-hole assembly to take care of specific customer requirements. Our through-hole process is tailored to low- to mid-volume, high mix assembly.
Logas also offers electromechanical assembling that conform to customer specifications and IPC standards. Logas offers turnkey services for electromechanical assembly including complete product assembly.Learn More
With increasing changes in technology and rapid innovation, Logas keep up to date and supports both mature and evolvign industries.
Logas understands the communications industry. We provide communication eletronics manufacturing services for products that will be sold any where in the world
Logas has manufactured components for various vehicle/transport systems such as: GPS systems, Vehicle diagnostic and control systems, Brain box panels, etc.
Our medical electronics manufacturing services include Leadfree, Turnkey, Asian Sourcing, Design for manufacturing, Prototyping, Supply Chain management etc. These are tailored to low- to mid-volume, high mix.